San Jose, United States, and Guangzhou, China 9th May 2024 - GOWIN Semiconductor Corporation, a global leader in FPGA technology and the fastest-growing provider in the industry, is thrilled to announce its debut participation at InfoComm 2024, taking place from June 12th to 14th in Las Vegas, United States. This milestone coincides with GOWIN's tenth anniversary, marking a significant moment in our journey. Join us at booth W1352, where we will unveil our latest FPGA innovations and demonstrate their transformative capabilities.   InfoComm stands as North America's premier audiovisual trade show, uniting manufacturers, integrators, dealers, and end-users worldwide to explore cutting-edge technologies, products, and services. At this esteemed event, we will present our groundbreaking FPGA offerings, notably highlighting the Arora V series. Renowned for their unparalleled SerDes performance and energy efficiency, these devices leverage TSMC’s 22nm LP process with proven automotive grade-1 capability, poised to redefine the mid-density FPGA market. Moreover, our new lineup offers exceptional power efficiency paired with competitive pricing, alongside compatibility with various competitor pin-compatible package options, facilitating seamless integration without PCB hardware redesign.   Our booth will feature live demonstrations showcasing the versatility and power of our FPGA solutions, including MIPI CSI camera to HDMI display bridging utilizing the Arora-V GW5A-25 family, a Universal Audio Class (UAC2) USB2.0 2x2 audio interface powered by the cost-effective LittleBee Flash-based GW1N-9 family, and a captivating beam forming demo.   In a special highlight, we are thrilled to announce that our esteemed CEO, Jason Zhu, will be joining our field sales team to engage in exclusive meetings with invited customers and partners. For those seeking visionary insights into the FPGA industry, this is an unparalleled opportunity to connect with a leader driving innovation.   Scott Casper, Senior Director of Sales, Americas, expressed his enthusiasm, stating, “We are incredibly excited to make our inaugural appearance at InfoComm, presenting our expanding portfolio of products, IP, and pioneering solutions. This event underscores our commitment to leadership in the evolving low and mid-density FPGA landscape.”   GOWIN Semiconductor eagerly anticipates welcoming all prospective customers and partners to booth W1352, where together, we'll explore the boundless possibilities of FPGA technology.   Supporting Resources:   For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/ For more information about and to register for the conference, visit https://www.infocommshow.org/   About GOWIN Semiconductor Corporation   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2024 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com

GOWINの中低密度FPGAの高い安全性と信頼性評価により、自動車OEM は、ビデオ ブリッジング、ディスプレイ駆動、画像信号処理などのアプリケーションを設計できるようになりました。     中国・広州 - 2024年4月30日- 世界的にも急成長しているFPGA企業であるGOWINセミコンダクターは、本日、GOWIN EDA(FPGA 設計環境)がTUV機関によってISO 26262およびIEC 61508機能安全規格に準拠していると認定されたことを発表しました。 GOWIN EDAの認証は、GOWIN Arora-V(中密度)、Arora-II(低/中密度)、またはLittleBee(低密度)FPGAを搭載したモジュール設計が、ISO 26262およびIEC 61508規格で規定されたシステムレベルの機能安全の要件を満たしていることを自動車OEMに強く保証するものです。 機能安全認証の取得により、GOWINのFPGAへの新たな関心が高まることが期待されています。GOWINは、AEC-Q100 Grade2の認定を受けたFPGAを提供し、AEC-Q100 Grade1の認定も申請中です。GOWINの製品群に適用される既存の品質および信頼性認証には、IATF16949、ISO 9001、ISO 14001およびISO/IEC 17025が含まれています。 同じ市場セグメントの他のFPGAよりも幅広い高速ビデオ、ディスプレイ、グラフィックス・インターフェースを含む優れた機能セットと、TSMCの22nm LPプロセスで製造されたデバイスの高い信頼性実績により、GOWINのFPGAはすでに自動車で次のような用途に使用されています。 インフォテインメント・システムにおけるビデオ・ブリッジングとローカル・ディスプレイの調光 先進運転支援システム(ADAS)におけるカメラ出力の画像信号処理 USBオーディオ・インターフェース インストルメント・クラスター上のディスプレイモニタリングと安全のバックアップ GOWINのCEO、Jason Zhu氏は次のように述べています。 「GOWINは、低密度および中密度セグメントにおけるFPGA設計の革新性により、自動車業界からの関心が高まっています。特筆すべきは、DDR3メモリや高速LVDS、PCIeインタフェースと並んで、ハードコアMIPIインタフェースをFPGAで提供していることです。好評を博している当社のGOWIN EDA開発環境が機能安全認証を取得したことで、弊社は欧州、北米、アジアの自動車市場にさらに進出できると確信しています。」 GOWIN EDA開発環境には、FPGA設計ツール、IPコア、リファレンス・デザインが含まれています。このFPGA設計ツールは、SystemVerilog、Verilog、およびVHDLプログラミング言語をサポートしています。GOWIN EDAの使用にはライセンス制限はなく、www.gowinsemi.comから無料でダウンロードできます。 GOWINの車載対応FPGA製品群とGOWIN EDA開発環境は、Embedded World (ドイツ、ニュルンベルク、2024年4月9～11日)のスタンド3A.340 でご覧いただけます。   GOWINセミコンダクターについて 2014年に設立され、主要なR＆Dを中国本社に置くGOWINセミコンダクターは、当社のプログラマブル・ソリューションで世界的に顧客のイノベーションを加速するビジョンを持っています。当社は、プログラマブル・ロジック・デバイスで製品の最適化と利便性を実現することに焦点を当てます。当社の技術と品質へのこだわりにより、顧客はFPGAを量産ボードに使用することでトータル・コストを削減できます。当社の製品には、プログラマブル・ロジック・デバイス、デザイン・ソフトウェア、IPコア、リファレンス・デザイン、および開発キットの幅広いポートフォリオが含まれています。当社はコンシューマ、インダストリアル、通信、医療、そしてオートモーティブ市場で世界中の顧客にサービスを提供することを目指しています。 GOWINの詳細については、www.gowinsemi.comをご覧ください。   ©2024 GOWIN Semiconductor Corp.GOWIN、LittleBee®、GW1N/NR/NS/1NSR/1NZ®、Arora®、Arora V®、GW2A /AR®、GOWIN EDA、およびその他のここに含まれる指定ブランドは、GOWINセミコンダクターの中国およびその他の国における商標です。その他すべての商標はそれぞれの所有者の財産です。詳細については、info@gowinsemi.comにメールしてください。   メディア連絡者: 佐伯昭二 shoji.saiki@gowinsemi.com   Rhianna Ogle、TKOマーケティング・コンサルタント rhianna@tko.co.uk  

  London, UK and Guangzhou, China 13th March 2024 - GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA provider, is set to participate in Embedded World 2024 from April 9th to 11th in Nuremberg, Germany. This will be our fourth consecutive appearance at the EW exhibition and coincides with GOWIN’s tenth anniversary year. Our home for this year’s event will be Hall 3A Stand 340 where we will be showcasing and demonstrating our latest FPGA technology.   Embedded World, hosted annually in Germany, stands as Europe's premier trade show for embedded solutions and technologies. Boasting over 1000 exhibitors, it ranks among the world's largest fairs dedicated to cutting-edge embedded technologies for IoT and related market segments.   Following significant automotive success in Asia, GOWIN will continue focusing on the European automotive market this year. We will showcase our latest FPGA offerings, including our new Arora V series devices, celebrated for their exceptional SerDes performance, and energy efficiency. Utilizing TSMC’s 22nm  LP process with proven automotive grade-1 capability, this new lineup is primed to make a significant impression on the mid density FPGA market. In addition to featuring industry-leading power efficiency with very competitive pricing,  this new device family is also available in a range of competitor pin-compatible package options, enabling customers to explore replacement options without redesigning their PCB hardware.   Stand demos this year will include MIPI CSI camera to HDMI display bridging using our new Arora-V GW5A-25 family, Universal Audio Class (UAC2) USB2.0 2x2 audio interface using our low-cost LittleBee Flash-based GW1N-9 family, a AE350 hardcore RISC-V demo using our latest Arora-V GW5AST-138 µSoC FPGA and Field Oriented Motor Control (FOC) using our mid-range Arora-2 family devices.   Finally, we are delighted to announce our field sales team will be accompanied by Jason Zhu, CEO of GOWIN, who will be conducting meetings with invited customers and partners. Please contact us if you are interested in scheduling time with a FPGA industry visionary.   “We are extremely excited to be once again participating at Embedded World in Nuremberg, Germany, showcasing our growing portfolio of products, IP, and innovative solutions.” said Mike Furnival, Vice President of International Sales. “Additionally, to have our CEO, Jason Zhu, joining us clearly illustrates the importance of our global sales efforts and resultant customer relationships. We believe that participation at this show will further cement our position as the true leader in the much changed low and mid density FPGA marketplace”.   GOWIN Semiconductor looks forward to welcoming all interested potential customers and partners to our booth in Hall 3A Stand 340.   Supporting Resources:   To schedule a meeting with GOWIN Semiconductor at Embedded World 2024, please fill out this Google Form here: https://docs.google.com/forms/d/e/1FAIpQLSfsROeh2n92rf3VWtl6-BBWNPMaem2aDyPBfHJSrHRnQ9FhDQ/viewform For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/ For more information about and to register for the conference, visit https://www.embedded-world.de/en About GOWIN Semiconductor Corporation Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2024 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com